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3D Integration in VLSI Circuits

element needed for 3D integration. There are numerous other key enabling technologies required for 3D integration, and the speed of the;

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3D Integration in VLSI Circuits: Implementation Technologies and Applications

element needed for 3D integration. There are numerous other key enabling technologies required for 3D integration, and the speed of the;

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3D Integration for VLSI Systems

Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the;

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Bio/CMOS Interfaces and Co-Design

/CMOS interfaces. This new approach, facilitated by 3D circuit design and nanotechnology, has resulted in new concepts and applications for VLSI;

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Bio/CMOS Interfaces and Co-Design

/CMOS interfaces. This new approach, facilitated by 3D circuit design and nanotechnology, has resulted in new concepts and applications for VLSI;

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VLSI and Post-CMOS Electronics

design, then goes on to cover through silicon via interconnects for 3D integration. Coverage further includes modelling and simulation for post;

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Design of 3D Integrated Circuits and Systems

integration schemes tested at IBM and case studies on advanced complementary metal-oxide-semiconductor (CMOS) integration for 3D integrated circuits;

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Design of 3D Integrated Circuits and Systems

at IBM and case studies on advanced complementary metal-oxide-semiconductor (CMOS) integration for 3D integrated circuits (ICs), Design of 3D;

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VLSI-SoC: Technologies for Systems Integration

Very Large Scale Integration, VLSI-SoC 2009, held in Florianopolis, Brazil, in October 2009. The 8 papers included in the book together with;

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VLSI Technology

As their name implies, VLSI systems involve the integration of various component systems. While all of these components systems are rooted;

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Advances In 3d Integrated Circuits And Systems

3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D;

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Advances In 3d Integrated Circuits And Systems

3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D;

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Low-Voltage Cmos Vlsi Circuits

Low-voltage very large scale integration (VLSI) circuits represent the electronics of the future. All electronic products are striving to;

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Energy-Efficient VLSI Architectures for Real-Time and 3D Video Processing

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Vlsi Design Of Wavelet Transform

is presented from the VLSI design perspective, and the related theories, algorithms, and architectures are discussed for 1D, 2D, and 3D DWT.The book;

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Advanced Metallization Conference 2001 (AMC 2001)

fields of VLSI metallization and vertical interconnect will yield a viable technical solution to the problem of multichip integration. This book;

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VLSI & Computer Architecture

Very-large-scale integration (VLSI) is the process of creating integrated circuits by combining thousands of transistor-based circuits into;

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VLSI-SoC: At the Crossroads of Emerging Trends

Very Large Scale Integration, VLSI-SoC 2013, held in Istanbul, Turkey, in October 2013. The 11 papers included in the book were carefully;

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Modern VLSI Design

VLSI or very-large-scale integration is a process of designing an integrated circuit (IC) by combining a large number of transistors or;

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VLSI-SoC: Design Trends

Very Large Scale Integration, VLSI-SoC 2020, held in Salt Lake City, UT, USA, in October 2020.*The 16 full papers included in this volume were;

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Architectures for Computer Vision

on Verilog vision modules, 3D vision modules, parallel vision architectures, and Verilog designs for the stereo matching system with various;

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3D Interconnect Architectures for Heterogeneous Technologies

heterogeneous 3D technologies for SoC integration, while also learning to maximize the 3D-technology gains, through a physical-effect-aware architecture;

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3D IC Integration and Packaging

IC Integration and Packaging covers: * 3D integration for semiconductor IC packaging * Through-silicon vias modeling and testing;

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VLSI Micro- and Nanophotonics

Addressing the growing demand for larger capacity in information technology, VLSI Micro- and Nanophotonics: Science, Technology, and;

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Theoretical Foundations of VLSI Design

computer science in general. The physical technologies of very large scale integration (VLSI) are having major effects on the electronic industry;

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Die-stacking Architecture

solutions to reduce the delay of interconnects in future microprocessors. 3D memory stacking enables much higher memory bandwidth for future chip;

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Mixed-Signal Systems

, recent advances in VLSI technology performance now allow for the integration of digital and analog circuits on a single chip, a process that;

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